The MEMS sensors that will be developed within MEMSENSE project will advance the state-of-the-art, implementing novel architectures and presenting unique features.

Each MEMS sensor will be developed in a unique fabrication process in order to fully exploit its features and achieve the best possible performance.

Each MEMS sensor will be interfaced with a signal conditioning ASIC, also developed within the project and fabricated based on modern submicron process. The processor will be of RISC/DSP architecture and will be initially implemented through an FPGA, and afterwards will be co-integrated in the same die with the electronics.

Finally, the MEMSENSE project aims at the design of different System in Packages (SiP) that will include the sensor, the readout electronics and the processor unit. The advantages of such a system are as follows:

The state of the art of the MEMSENSE project in the field of sensors:

The state of the art of the MEMSENSE project in the field of the end-to-end smart sensors network architecture, control gateway and back-end:

The state of the art of the MEMSENSE project in the field of devices/ICs for wireless interfaces:

The state of the art of the MEMSENSE project in the field of energy-autonomous sensors:

The state of the art of the MEMSENSE project in regard to the intelligent microphone:

The state of the art of the MEMSENSE project in the field of integrated applications:

 

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